OCTAVEO family of BGA Inspection systems is a low cost but accurate
solution for micro balls inspection. It combines the power of pattern
recognition with the power of precision metrology. Structured lighting
and highly optimised metrology algorithms provide blazing speed
for detection of missing, deformed, or misaligned solder balls as
well as isolation of individual ball height deviations from coplanarity.
A powerful scripting environment allows test engineers to customise
production mode test sequences for individual styles and sizes of
BGA chips as well as binning of the measurement results. We offer
a variety of pricing options to satisfy the budget requirements
of any manufacturing, assembly or test facility.
OCTAVEO models are equipped with 1.3 megapizel cameras and optics
that were selected for processing solder balls from .3 to .5mm in
diameter. Within this range, BGA sizes typically vary from 5 to
13 millimeters. Optional higher resolution cameras and specialised
optics can be requested for chips that fall outside of these parameters.
The software can handle array sizes up to 30 x 30 balls. Any amount
of site depopulation is supported.
chips are presented to a 90 mm wide viewing port located at one
end of the enclosure that holds the cameras, optics, lighting, and
interface electronics. Chips should be located 2-3 millimeters from
the bottom surface of the enclosure, which may be mounted in any
Shape Recognition and Precision Metrology
- Fast Shape
Uniformity and Coplanarity Measurements (<200ms)
- High Measurement
Repeatability (2% Typical for 2D Metrology)
Script Driven Test Sequence
Grid Fitting Algorithm Detects BGA Chip Warpage
Input / Outputs
- Rugged Industrial
- Models 50/80/100/200